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Products

Products

Laser Application

SP3965(UV Laser driller)
GS9066(CO2 Laser cut)
SP3265(Pico Fine Cutter)
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SP3965-20M

Drilling and Cutting for Semiconductor and FPCB

Dual Head (MD)

Sheet to Sheet (S2S)

Roll to Roll (R2R)

Robotics Automation System for FPCB

System Features

User-centric and easy to use multilingual control panel. (Support Korean, Chinese, English, Japanese)
Advanced 2D On the fly
Position Based Output
Automatic thickness measurement and processing position compensation.
Independent control of Laser frequency and Laser output power
Maximize productivity with all-in-one material feed system
(Custom Option : Dual head, Sheet to Sheet, Roll to Roll)
Coreless linear motor applied on the Granite
Minimize the foreign bodies with high-pressure dust collector and air blow
By using Laser sources independently, Dual processing(Copy) and operating two of Manual type are available
Stable manufacturing with real time measurement and calibration of laser power while processing.

Specification

Classification Specification
SP3965-20M
Laser Type UV ns LASER / 355㎚
Avg.Out Power 18W@100 ㎑ at Work Position
Laser Frequency 100~500 ㎑
Scan Scope & Method Advanced 2D on the Fly
X-Y Stage Split Stage, Coreless Linear Motor
Panel Size 650㎜ × 550㎜
Cutting Accuracy ±10 ㎛ @avg
PTH Drilling Dia min 25 ㎛
BVH Drilling Dia min 35 ㎛
Loader / Un-loader Additional Option (Sheet to Sheet & Roll to Roll)
Electric Power 220V, 3-phase, 50/60㎐

Drilling Sample Image

Hole Size 25㎛ (X20) 50㎛ (X20) 75㎛ (X20) 100㎛ (X20) 200㎛ (X20)
PTH
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※1 Step process using the spiral method ※Before cleaning

Double Side FPCB

After laser processing

Copper plating

Multi Layer FPCB

After laser processing

Copper plating

Hole Size 35㎛ (X20) 50㎛ (X20) 75㎛ (X20) 100㎛ (X20) 200㎛ (X20)
BVH
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※2 Step process using the spiral method ※Before cleaning

Special

Datamatrix marking, Skiving align, Advanced Log tracker, 8 ways auto align searcher, Realtime Laser power tracker,
Advanced Multi Cell aligner, Realtime drilling hole counter, Advanced auto tracking marking with Datamatrix

Adv. Option

AOD Unit, Beam Shaper unit for round or square shape beam, PICO Laser source(SP3265)

PI Drilling (SPL SEM Image)

35um diameter Polyimid Blind Via Hole

40um diameter Polyimid Blind Via Hole

Cutting Sample Image

Cutting Sample Image

FPCB Full-cut

Coverlay

Prepreg

Cutting Sample Image

FPCB Full-cut

Coverlay

Prepreg

Cutting Sample Image

FPCB Full-cut

2-System Engineering

LASER APPLICATION